Package Resources
The Package Resource page reveals key package application and process information.
- Tape and Reel Specifications—Surface Mount for LT/LTC/LTM Products
- Surface Mount Products - Marking, Soldering, Thermal Info, Shipping Tubes for LT/LTC Products
- Solder Profile per Jedec Standards (Login required)
- Key Package Information
- Full Material Declaration RoHS Search
- IPC Standards
- Thermal Resistance Table (PDF)
Application Notes
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Hydrogen Effects On Exotic Material Devices (Rev. 1.1) PDF
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AN-1448: Recommended Rework Procedure for PBGA Packages (Rev. 0) PDF
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AN-1389: Recommended Rework Procedure for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0) PDF
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Layout Guidelines for MMIC Components PDF
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SMT Assembly for Leadless Packages PDF
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Gel-PAK® & Waffle Pack Bare Die (Chip) Packaging Information PDF
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AN-000: Thermal Characteristics (Rev. 0) PDF
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AN-617: MicroCSP Wafer Level Chip Scale Package PDF
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AN-001: Tube and Tray Device Counts (Rev. B) PDF
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Application Notes for Thermally Enhanced Leaded Plastic Packages PDF
Package
Tutorials
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MT-101: Decoupling Techniques pdf
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MT-093: Thermal Design Basics pdf
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MT-096: RFI Rectification Concepts pdf
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MT-095: EMI, RFI, and Shielding Concepts pdf
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MT-099: Analog Circuit Simulation PDF
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MT-100: Breadboarding and Prototyping Techniques pdf
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MT-098: Low Voltage Logic Interfacing pdf
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MT-097: Dealing with High Speed Logic pdf
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MT-094: Microstrip and Stripline Design pdf
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MT-092: Electrostatic Discharge (ESD) pdf