Packaging, Quality, Symbols & Footprints
Designing your printed circuit board (PCB) takes careful preparation and planning. Package size, pitch, and spacing are critical to ensure that your board design is accurate and will function correctly.
Package Index
The package index contains all outline drawings and Material declarations for those packages. View More
- BGA (Ball Grid Array)
- CSP (Chip Scale Package)
- DIP (Dual Inline Package)
- FlatPack
- Header
- LCC (Leaded or Leadless Chip Carrier)
- LGA (Land Grid Array)
- PGA (Pin Grid Array)
- QFP (Quad Flat Pack)
- SIP (Single Inline Package)
- SOIC (Small Outline IC)
- SOP (Small Outline Package)
- SOT (Small Outline Transistor)
Quality & Reliability
Information about Analog Devices' quality systems and reliability programs. View More
Symbols, Footprints & 3D Models
Analog Devices offers Symbols & Footprints which are compatible with a large set of today’s CAD systems. View More